doc. no : qw0905-la79b-1/gxxg-s2-pf rev. : a date : 14 - aug. - 2006 la79b-1/gxxg-s2-pf data sheet led array pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
+ - 8.5 0.5 2.9 3.3 4.3 3.1 - 2.54typ 29.5min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. + 0.5 typ 1.5 max lg2640/s36-pf g + - 28.5min 3.5 0.5 part no. la79b-1/gxxg-s2-pf 2.5 g 5.08 0.5 typ 2.54typ x x 4.4 2.9x4 g package dimensions page 1/5 20.3 2.8 0.5 3.5 0.5 10.7 2.9 ligitek electronics co.,ltd. property of ligitek only 1.5
tstg -40 ~ +100 storage temperature note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. la79b-1/gxxg-s2-pf green gap 565 green diffused 1.7 3020 12 2.6 50 forward voltage @20ma(v) typical electrical & optical characteristics (ta=25 ) emitted part no material peak wave length pnm spectral halfwidth nm lensmin. color viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) min. max. typ. page 2/5 30 g 120 10 100 i f forward current t opr operating temperature reverse current @5v -40 ~ +85 ir peak forward current duty 1/10@10khz power dissipationpd i fp absolute maximum ratings at ta=25 symbol parameter ratings ma a ma mw unit ligitek electronics co.,ltd. property of ligitek only part no. la79b-1/gxxg-s2-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 3/5 part no. la79b-1/gxxg-s2-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 60 seconds max 50 100 0 0 preheat 25 2 /sec max 120 150 time(sec) 260 5 /sec max 260 c3sec max temp( c) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. la79b-1/gxxg-s2-pf
1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solderability test 1.t.sol=230 5 2.dwell time=5 1sec thermal shock test solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 the purpose of this test is the resistance of the device under tropical for hours. 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test low temperature storage test high temperature storage test test condition test item reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 description reference standard ligitek electronics co.,ltd. property of ligitek only page 5/5 part no. la79b-1/gxxg-s2-pf
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